Описание
Уязвимость функции supply_lm_input_write файла drivers/thermal/supply_lm_core.c драйвера MSM Thermal ядра операционной системы Linux вызвана переполнением буфера на стеке. Эксплуатация уязвимости может позволить нарушителю вызвать отказ в обслуживании или оказать другое воздействие с помощью специально созданного приложения, которое отправляет большое количество данных по интерфейсу debugfs
Вендор
Наименование ПО
Версия ПО
Тип ПО
Операционные системы и аппаратные платформы
Уровень опасности уязвимости
Возможные меры по устранению уязвимости
Статус уязвимости
Наличие эксплойта
Информация об устранении
Идентификаторы других систем описаний уязвимостей
- CVE
EPSS
7.8 High
CVSS3
6.8 Medium
CVSS2
Связанные уязвимости
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
EPSS
7.8 High
CVSS3
6.8 Medium
CVSS2