Описание
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Ссылки
- Vendor Advisory
- Vendor Advisory
Уязвимые конфигурации
Одновременно
Одновременно
Одновременно
Одновременно
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Одновременно
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Одновременно
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Одновременно
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Одновременно
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Одновременно
Одновременно
EPSS
7.8 High
CVSS3
4.6 Medium
CVSS2
Дефекты
Связанные уязвимости
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
EPSS
7.8 High
CVSS3
4.6 Medium
CVSS2