CVE-2020-11202

Опубликовано: 12 нояб. 2020

Источник: nvd

CVSS3: 7.8

CVSS2: 7.2

EPSS Низкий

Описание

Buffer overflow/underflow occurs when typecasting the buffer passed by CPU internally in the library which is not aligned with the actual size of the structure' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P

Ссылки

https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/
Third Party Advisory
https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/
Exploit
Third Party Advisory
https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin
Broken Link
Vendor Advisory
https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/
Third Party Advisory
https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/
Exploit
Third Party Advisory
https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin
Broken Link
Vendor Advisory

Уязвимые конфигурации

Конфигурация 1

Одновременно

cpe:2.3:o:qualcomm:qcm6125_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:qcm6125:-:*:*:*:*:*:*:*

Конфигурация 2

Одновременно

cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:qcs410:-:*:*:*:*:*:*:*

Конфигурация 3

Одновременно

cpe:2.3:o:qualcomm:qcs603_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:qcs603:-:*:*:*:*:*:*:*

Конфигурация 4

Одновременно

cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*

Конфигурация 5

Одновременно

cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:qcs610:-:*:*:*:*:*:*:*

Конфигурация 6

Одновременно

cpe:2.3:o:qualcomm:qcs6125_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:qcs6125:-:*:*:*:*:*:*:*

Конфигурация 7

Одновременно

cpe:2.3:o:qualcomm:sa6145p_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sa6145p:-:*:*:*:*:*:*:*

Конфигурация 8

Одновременно

cpe:2.3:o:qualcomm:sa6155_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sa6155:-:*:*:*:*:*:*:*

Конфигурация 9

Одновременно

cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sa6155p:-:*:*:*:*:*:*:*

Конфигурация 10

Одновременно

cpe:2.3:o:qualcomm:sa8155_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sa8155:-:*:*:*:*:*:*:*

Конфигурация 11

Одновременно

cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sa8155p:-:*:*:*:*:*:*:*

Конфигурация 12

Одновременно

cpe:2.3:o:qualcomm:sda640_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sda640:-:*:*:*:*:*:*:*

Конфигурация 13

Одновременно

cpe:2.3:o:qualcomm:sda670_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sda670:-:*:*:*:*:*:*:*

Конфигурация 14

Одновременно

cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sda845:-:*:*:*:*:*:*:*

Конфигурация 15

Одновременно

cpe:2.3:o:qualcomm:sdm640_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sdm640:-:*:*:*:*:*:*:*

Конфигурация 16

Одновременно

cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sdm670:-:*:*:*:*:*:*:*

Конфигурация 17

Одновременно

cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sdm710:-:*:*:*:*:*:*:*

Конфигурация 18

Одновременно

cpe:2.3:o:qualcomm:sdm830_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sdm830:-:*:*:*:*:*:*:*

Конфигурация 19

Одновременно

cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sdm845:-:*:*:*:*:*:*:*

Конфигурация 20

Одновременно

cpe:2.3:o:qualcomm:sdx50m_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sdx50m:-:*:*:*:*:*:*:*

Конфигурация 21

Одновременно

cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sdx55:-:*:*:*:*:*:*:*

Конфигурация 22

Одновременно

cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sdx55m:-:*:*:*:*:*:*:*

Конфигурация 23

Одновременно

cpe:2.3:o:qualcomm:sm6125_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sm6125:-:*:*:*:*:*:*:*

Конфигурация 24

Одновременно

cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sm6150:-:*:*:*:*:*:*:*

Конфигурация 25

Одновременно

cpe:2.3:o:qualcomm:sm6150p_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sm6150p:-:*:*:*:*:*:*:*

Конфигурация 26

Одновременно

cpe:2.3:o:qualcomm:sm6250_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sm6250:-:*:*:*:*:*:*:*

Конфигурация 27

Одновременно

cpe:2.3:o:qualcomm:sm6250p_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sm6250p:-:*:*:*:*:*:*:*

Конфигурация 28

Одновременно

cpe:2.3:o:qualcomm:sm7125_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sm7125:-:*:*:*:*:*:*:*

Конфигурация 29

Одновременно

cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sm7150:-:*:*:*:*:*:*:*

Конфигурация 30

Одновременно

cpe:2.3:o:qualcomm:sm7150p_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sm7150p:-:*:*:*:*:*:*:*

Конфигурация 31

Одновременно

cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sm8150:-:*:*:*:*:*:*:*

Конфигурация 32

Одновременно

cpe:2.3:o:qualcomm:sm8150p_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sm8150p:-:*:*:*:*:*:*:*

EPSS

Процентиль: 19%

0.0006

Низкий

7.8 High

CVSS3

7.2 High

CVSS2

Дефекты

CWE-787

Связанные уязвимости

GHSA-wpq8-j8vm-5vmh

github

больше 3 лет назад

u'Buffer overflow/underflow occurs when typecasting the buffer passed by CPU internally in the library which is not aligned with the actual size of the structure' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P

EPSS

Процентиль: 19%

0.0006

Низкий

7.8 High

CVSS3

7.2 High

CVSS2

Дефекты

CWE-787