Описание
In the Linux kernel, the following vulnerability has been resolved:
RDMA/hns: Fix memory leak of bonding resources
In a corner case of concurrent driver removal and driver reset,
bonding resource is first released in hns_roce_hw_v2_exit() during
driver removal, and then is allocated again in hns_roce_register_device()
during driver reset. This leads to memory leak because the release
timing has already passed. This may also lead to a kernel panic
as below because of the leaked notifier callback:
Call trace:
0xffffa20fccc04978 (P)
raw_notifier_call_chain+0x20/0x38
call_netdevice_notifiers_info+0x60/0xb8
netdev_lower_state_changed+0x4c/0xb8
As Sashiko suggested, the teardown order of bonding resources should
be inverted to make sure the resources are released when the driver
is removed.
A flaw was found in the Linux kernel's RDMA/hns component. During concurrent driver removal and reset operations, bonding resources are incorrectly released and then re-allocated, leading to a memory leak. This memory leak can potentially cause a kernel panic, resulting in a Denial of Service (DoS) for the affected system.
Затронутые пакеты
| Платформа | Пакет | Состояние | Рекомендация | Релиз |
|---|---|---|---|---|
| Red Hat Enterprise Linux 10 | kernel | Not affected | ||
| Red Hat Enterprise Linux 6 | kernel | Not affected | ||
| Red Hat Enterprise Linux 7 | kernel | Not affected | ||
| Red Hat Enterprise Linux 7 | kernel-rt | Not affected | ||
| Red Hat Enterprise Linux 8 | kernel | Not affected | ||
| Red Hat Enterprise Linux 8 | kernel-rt | Not affected | ||
| Red Hat Enterprise Linux 9 | kernel | Not affected | ||
| Red Hat Enterprise Linux 9 | kernel-rt | Not affected |
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Дополнительная информация
Статус:
EPSS
5.5 Medium
CVSS3
Связанные уязвимости
In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hns_roce_hw_v2_exit() during driver removal, and then is allocated again in hns_roce_register_device() during driver reset. This leads to memory leak because the release timing has already passed. This may also lead to a kernel panic as below because of the leaked notifier callback: Call trace: 0xffffa20fccc04978 (P) raw_notifier_call_chain+0x20/0x38 call_netdevice_notifiers_info+0x60/0xb8 netdev_lower_state_changed+0x4c/0xb8 As Sashiko suggested, the teardown order of bonding resources should be inverted to make sure the resources are released when the driver is removed.
In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hns_roce_hw_v2_exit() during driver removal, and then is allocated again in hns_roce_register_device() during driver reset. This leads to memory leak because the release timing has already passed. This may also lead to a kernel panic as below because of the leaked notifier callback: Call trace: 0xffffa20fccc04978 (P) raw_notifier_call_chain+0x20/0x38 call_netdevice_notifiers_info+0x60/0xb8 netdev_lower_state_changed+0x4c/0xb8 As Sashiko suggested, the teardown order of bonding resources should be inverted to make sure the resources are released when the driver is removed.
In the Linux kernel, the following vulnerability has been resolved: R ...
In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hns_roce_hw_v2_exit() during driver removal, and then is allocated again in hns_roce_register_device() during driver reset. This leads to memory leak because the release timing has already passed. This may also lead to a kernel panic as below because of the leaked notifier callback: Call trace: 0xffffa20fccc04978 (P) raw_notifier_call_chain+0x20/0x38 call_netdevice_notifiers_info+0x60/0xb8 netdev_lower_state_changed+0x4c/0xb8 As Sashiko suggested, the teardown order of bonding resources should be inverted to make sure the resources are released when the driver is removed.
EPSS
5.5 Medium
CVSS3